Method to fuse silicone and thermoplastic resin
US9982101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2016 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Oct 18, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps: Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.