Polyamide composition
US9982133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2014 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jul 22, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention pertains to a filled polyamide composition [composition (C)] comprising: —from 35 to 80% wt of at least one polyhydric alcohol-modified polyamide, comprising an amount of polyhydric alcohol (PHA, herein after) residues chemically bonded at least to a part of the polyamide [polyamide (A)] of at least 0.1% wt (based on the total weight of polyamide (A)); —from 10 to 65% wt of at least one filler [filler (F)]; —from 1 to 10% wt of at least one impact modifying rubber [rubber (I)]; and —from 0.01 to 3% wt of at least one copper-containing stabilizer, with above % wt being referred to the total weight of composition (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.