Metal oxide-polymer composite particles for chemical mechanical planarization
US9982166B2 · kind B2 · utility
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23Claims
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Key dates
| Filing date | Dec 16, 2014 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Dec 16, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
CMP processes, tools and slurries utilize metal oxide-polymer composite particles that include metal oxide particles and a polymer core. The metal oxide particles are modified with a modifying agent and are partially or fully embedded within the polymer core. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.