Polyurethane hot-melt adhesive having a low content of diisocyanate monomers and good cross-linking speed

US9982173B2 · kind B2 · utility

Assignee

• SIKA TECHNOLOGY AG · CH

Inventors

• Doreen Janke · Leck, DE
• Mathias Cordes · Hamburg, DE
• Kai Paschkowski · Jork, DE

Key dates

• Filing date: Mar 5, 2015
• Grant date: May 29, 2018
• Expiry date: Mar 5, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2475/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.