Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
US9982177B2 · kind B2 · utility
5Cited by
16References
25Claims
0Family size
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Key dates
| Filing date | Jan 20, 2011 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jan 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry includes abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. A polishing liquid includes abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.