Film-forming mask, film-forming device, and film-forming method
US9982339B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2016 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A mask comprises a mask substrate having a protruding section in an opening end surface of an opening, having an acute angle defined by θ1 and θ2 of no more than 43°, and having a height from a film-formation surface on the substrate to a tip section of the protruding section greater than the thickness of the film to be formed on the film-formation surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.