Housing of electronic module, electronic module, light emitting module and backlight module
US9982869B2 · kind B2 · utility
0Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2012 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Apr 2, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133608
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.