Test socket for testing semiconductor chip package and method of manufacturing the same
US9983229B2 · kind B2 · utility
1Cited by
26References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jun 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.