High density optical packaging header apparatus
US9983362B2 · kind B2 · utility
14Cited by
60References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2017 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jun 2, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.