Patent · US Active

Semiconductor assembly having a press pack stack

US9984953B2 · kind B2 · utility

1Cited by

14References

18Claims

0Family size

Assignee

ABB Schweiz AG · CH

Inventors

Olle Ekwall · Ludvika, SE
Erik Doré · Ludvika, SE
Franc Dugal · Benglen, CH
Raffael Schnell · Seon, CH

Key dates

Filing date	Dec 7, 2012
Grant date	May 29, 2018
Priority date	—
Expiry date	Jan 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.