Method for producing an optoelectronic semiconductor chip
US9985011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2014 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing an optoelectronic semiconductor chip is disclosed. A semiconductor body has a pixel area, which has at least two different subpixel areas. An electrically conductive layer is applied to the radiation outlet surface of at least one subpixel area. The electrically conductive layer is designed to at least partially salify with a protic reaction partner. A conversion layer is deposited onto the electrically conductive layer by means of a electrophoresis process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.