Electronic devices
US9985207B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2005 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Aug 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/464
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an electronic device including the steps of: (i) providing a body including a first, conductive element separated from a first surface of said body by a portion of said body; (ii) removing a selected portion of said body to define a recess in said body extending from said first surface and via which a portion of said first element is exposed; and (iii) putting into said recess a liquid medium carrying a first material; wherein said first material is preferentially deposited on the exposed inner surface of said body defining said recess, and wherein the deposited first material is used to provide a connection between said first element and a second conductive element located within said body or later deposited over said first surface of said body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.