Enclosure for heating three dimensional structure
US9986602B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | May 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2206/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An enclosure for heating a three dimensional structure. The enclosure comprising a body defining a cavity therein. The cavity sized to receive a three dimensional structure. A plurality of heating blankets configured to heat the three dimensional structure to a substantially uniform temperature. At least one of the plurality of heating blankets comprises a conductor for receiving current and generating a magnetic field in response thereto, a first susceptor wire comprising an alloy having a first Curie temperature point and a second susceptor wire. The second susceptor wire comprising a second Curie temperature point that is different than the first Curie temperature point of the first susceptor wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.