High thermal conductivity materials for thermal management applications
US9986663B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Jan 29, 2014 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jan 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.