Molding apparatus, molding apparatus unit, and molding method
US9987774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2016 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jun 13, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2905/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus (1) includes: a servomotor (11) for pressing a resin component (W) by moving an upper mold (MU) in a direction in which the upper mold (MU) is made close to a lower mold (ML); servomotors (12a and 13a) each of which retains X-coordinate and Y-coordinate positions of the lower mold (ML); and a position detection section (41) which determines whether or not the resin component which is sandwiched between the upper mold and the lower mold has been cured, the servomotors each terminating the retention of the lower mold when the resin component has been cured. This makes it possible to obtain a molded product while preventing positional displacement caused by a decrease in volume of a resin which is being cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.