Patent · US Active

Method and device for removing integrated circuits

US9987836B2 · kind B2 · utility

0Cited by

7References

15Claims

0Family size

Assignees

Inventors

Yong Sun · Beijing, CN
Xianzhen Tang · Beijing, CN
Zhiyu Qian · Beijing, CN
Long Yan · Beijing, CN
Jun Zhang · Beijing, CN
Daocheng Zhu · Los Angeles, US
Wei Wang · Beijing, CN

Key dates

Filing date	Jun 18, 2015
Grant date	Jun 5, 2018
Priority date	—
Expiry date	Mar 31, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/77
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present disclosure provides a method and device for removing an integrated circuit. The device is used to remove the integrated circuit from a display panel. The device includes a heating unit configured to contact and heat the display panel, and a retractable clamping-taking component configured to clamp and take the integrated circuit on the display panel which has been heated. According to embodiments of the present disclosure, the method and device may remove the integrated circuit from the display panel without destroying the display panel and increase efficiency of removing the integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.