Patent · US Active

Micromechanical device and method for manufacturing a micromechanical device

US9988261B2 · kind B2 · utility

0Cited by

4References

5Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Julian Gonska · Reutlingen, DE
Jochen Reinmuth · Reutlingen, DE
Kathrin Gutsche · Oberhausen, DE

Key dates

Filing date	Jun 13, 2013
Grant date	Jun 5, 2018
Priority date	—
Expiry date	Nov 2, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2201/025
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.