HMPSA for removable self-adhesive label
US9988528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jul 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a hot-melt pressure-sensitive adhesive (HMPSA) composition. The composition includes: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which includes 6 to 22 carbon atoms. The present invention also relates to a multilayer system including an HMPSA layer, a printable support layer, and an adjacent protective layer. Further, the present invention also includes a corresponding self-adhesive label and process for recycling a labeled article which entails debonding of the label by immersing the article in a hot basic aqueous solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.