Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same
US9989852B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition including: a polysiloxane synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.