Component with internal sensor and method of additive manufacture
US9990576B2 · kind B2 · utility
10Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2015 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jan 23, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A component may be self-monitoring having a sensor assembly located on a surface of a substrate and covered by an encapsulating layer additively manufactured over the sensor assembly and thereby bonded to the substrate. The sensor may be wireless, self-powered, and embedded into the substrate such that it is unobtrusive and may not limit the performance or function of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.