Systems and methods for fabricating single-crystalline diamond membranes
US9991113B2 · kind B2 · utility
4Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A buffer layer is employed to fabricate diamond membranes and allow reuse of diamond substrates. In this approach, diamond membranes are fabricated on the buffer layer, which in turn is disposed on a diamond substrate that is lattice-matched to the diamond membrane. The weak bonding between the buffer layer and the diamond substrate allows ready release of the fabricated diamond membrane. The released diamond membrane is transferred to another substrate to fabricate diamond devices, while the diamond substrate is reused for another fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.