Electronic module and method of manufacturing the same
US9991184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 28, 2013 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | May 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1679
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module 1 includes an electronic module 10 that includes a substrate 11 and an electronic element 12, an electronic module 20 that includes a substrate 21 arranged such that the principal surface 21a faces the principal surface 11a, an electronic element 22 electrically connected to the electronic element 12 with a connecting member 18 therebetween, and an electronic element 23 electrically connected to the electronic element 12 with a connecting member 19 therebetween passing through the substrate 21 in a thickness direction, the electronic module 20 thermally connected to the electronic module 10 by the connecting members 18 and 19, and a heat sink 30 that includes a housing part 31a therein and houses the electronic modules 10 and 20 in the housing part 31a such that the principal surface 11b is in contact with an inner wall surface of the housing part 31a.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.