Patent · US Active

Surface acoustic wave (SAW) resonator

US9991870B2 · kind B2 · utility

2Cited by
26References
38Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 28, 2016
Grant dateJun 5, 2018
Priority date
Expiry dateMay 17, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH03H9/6483
  • WIPO fieldBasic communication processes
  • WIPO sectorElectrical engineering

Abstract

A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A silicon layer disposed between a first surface of the layer and a second surface of the piezoelectric layer. A first surface of the silicon layer has a smoothness sufficient to foster atomic bonding between the first surface of the silicon layer and the second surface of the piezoelectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.