Hermetic filter feedthrough including MLCC-type capacitors for use with an active implantable medical device
US9993650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Dec 12, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.