Methods of fabricating electronic and mechanical structures
US9993982B2 · kind B2 · utility
11Cited by
205References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2012 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Feb 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/037
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.