Patent · US Active

Resin mixture based on epoxy(meth)acrylate resin, and the use thereof

US9994655B2 · kind B2 · utility

2Cited by

6References

20Claims

0Family size

Assignee

Hilti Aktiengesellschaft · LI

Inventors

Gerald Gaefke · Kaufbeuren, DE
Thomas Bürgel · Landsberg, DE
Michael Leitner · Landsberg, DE

Key dates

Filing date	May 21, 2015
Grant date	Jun 12, 2018
Priority date	—
Expiry date	May 21, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2111/00715
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to a resin mixture having a modified epoxy (meth)acrylate resin as the base resin, and optionally at least one reactive diluent, at least one stabilizer, and at least one accelerator, wherein the modified epoxy (meth)acrylate resin can be obtained by reacting organic compounds having epoxide groups with (meth)acrylic acid, and then by the partial esterification of the β-hydroxyl-groups, the same formed during the reaction, with the anhydride of a saturated dicarboxylic acid, to reactive resin mortars containing the same, and to the use thereof for the purpose of chemical fastening, by means of which it is possible to manufacture products which are not subject to labeling requirements and which additionally provide high bond strength.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.