Copper film with large grains, copper clad laminate having the same and manufacturing method of copper clad laminate
US9994967B2 · kind B2 · utility
2Cited by
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16Claims
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Key dates
| Filing date | Nov 23, 2015 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a copper film with large grains, where, at least one surface, more than 50% area of the copper film is [100]-oriented grains, and the average size of [100]-oriented grains is more than 150 μm. The grains on the copper film have large grain sizes and high preferred orientation, so that the copper film is provided with excellent properties such as flexibility, stability and electro-migration resistance. A copper foil laminate with the above-mentioned copper film is also herein provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.