Paper or paperboard substrate, a process for production of the substrate and a package formed of the substrate
US9994999B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2010 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Feb 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/253
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a paper or paperboard substrate having barrier properties which substrate comprises a first fiber based layer, a second layer comprising micro-fibrillated cellulose, a third layer comprising a heat sealable polymer, and a fourth layer comprising aluminum, aluminum oxide or titanium dioxide. The invention further relates to a process for the production of said substrate and a package formed of said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.