Patent · US Active

TSV compatible fiber array coupler for silicon photonics

US9995881B1 · kind B1 · utility

15Cited by

2References

17Claims

0Family size

Assignee

Cisco Technology, Inc. · US

Inventors

Vipulkumar Patel · Emmaus, US
Mittu Pannala · Weilersville, US
Steven Luther Moyer · Lancaster, US

Key dates

Filing date	Jun 28, 2017
Grant date	Jun 12, 2018
Priority date	—
Expiry date	Jun 28, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG02B2006/12147
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Embodiments herein describe an apparatus for coupling a photonic chip with a plurality of optical fibers. In one embodiment, the apparatus comprises a first plurality of alignment features that correspond to a second plurality of alignment features associated with the photonic chip. Further, the apparatus comprises a plurality of grooves for receiving the plurality of optical fibers. In one embodiment, the apparatus comprises a plurality of waveguides for transmitting or receiving an optical signal. The plurality of waveguides is optically coupled to the photonic chip, as well as the plurality of optical fibers. In one embodiment, the plurality of waveguides is passively aligned with a second plurality of waveguides associated with the photonic chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.