Methods of patterning and making masks for three-dimensional substrates
US9995951B2 · kind B2 · utility
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1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2015 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/143
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method of making a mask for patterning a three-dimensional substrate. A mandrel includes a form machined in a surface corresponding to a shape of the substrate. A layer of material is deposited in a first region of the form and a metal layer is deposited in a second region of the form. A portion of the mandrel is subsequently removed. The present invention also provides a method of patterning a three-dimensional substrate with a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.