Thermal simulation device and method for integrated circuits
US9996641B2 · kind B2 · utility
0Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Sep 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal simulation device for an integrated circuit according to the disclosure comprises a thermal analysis unit and a mesh size analysis unit. The thermal analysis unit performs a thermal analysis of the integrated circuit to obtain temperatures of the center point and boundary of each function block. The mesh size analysis unit determines the cell number in the mesh of each function block. The thermal analysis unit computes a temperature of the center point and boundary of each cell in every function block according to the temperatures of the boundary of each function block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.