Methods of forming configurable microchannels in package structures
US9997377B2 · kind B2 · utility
1Cited by
1References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 14, 2012 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.