Electronic device provided with a thermal dissipation member
US9997431B2 · kind B2 · utility
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3References
26Claims
0Family size
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Key dates
| Filing date | Mar 7, 2017 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Mar 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.