Solder stud structure
US9997482B2 · kind B2 · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2014 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Mar 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure is provided. The semiconductor structure includes a first substrate and a metal pad formed over the first substrate. The semiconductor structure further includes a solder stud formed over the metal pad, and the solder stud has a flat top surface parallel to a top surface of the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.