Electronic device module and method of manufacturing the same
US9997504B2 · kind B2 · utility
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1References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 21, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.