Patent · US Active

Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips

US9997671B2 · kind B2 · utility

0Cited by

9References

12Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Johannes Baur · Regensburg, DE
Berthold Hahn · Hemau, DE
Volker Haerle · Waldetzenberg, DE
Karl Engl · Niedergebraching, DE
Joachim Hertkorn · Neukirchen, DE
Tetsuya Taki · Miyoshi, JP

Key dates

Filing date	Jun 15, 2015
Grant date	Jun 12, 2018
Priority date	—
Expiry date	Jun 15, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73265
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.