Elastic wave device and fabrication method thereof
US9998091B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Oct 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/54
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An elastic wave device includes a dielectric film on a piezoelectric substrate, an IDT electrode including first and second comb electrodes on the dielectric film, first and second wiring electrodes electrically connected to the first and second comb electrodes, wherein the first comb electrode and the second comb electrode each include electrode fingers and a busbar in contact with the electrode fingers. An electrical conductivity of the piezoelectric substrate is higher than the electrical conductivity of the dielectric film. At least one of the first wiring electrode, the second wiring electrode, the busbar of the first comb electrode, and the busbar of the second comb electrode includes a portion that is in direct contact with the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.