Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
US9999124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Nov 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Tamper-respondent assemblies with regions of increased susceptibility to a tamper event are provided, which include one or more tamper-detect sensors, one or more conductive traces, and an adhesive. The tamper-detect sensor(s) facilitates defining a secure volume about one or more electronic components to be protected, and the conductive trace(s) forms, at least in part, a tamper-detect network of the tamper-respondent assembly. The conductive trace(s) is disposed, at least in part, on the tamper-detect sensor(s). The adhesive contacts the conductive trace(s) on the tamper-detect sensor(s), and is disposed, at least in part, between and couples a surface of the tamper-detect sensor(s) to another surface of the assembly. Together, the tamper-detect sensor(s), conductive trace(s), and adhesive are a subassembly, with the subassembly being configured with multiple regions of increased susceptibility to breaking of the conductive trace(s) with a tamper event through the subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.