Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate
US9999130B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 7, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Nov 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.