Bond pattern for substrate
USD1076074S1 · kind S1 · design
0Cited by
78References
1Claims
0Family size
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Key dates
| Filing date | Apr 18, 2024 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | May 20, 2040 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.