Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards
USD288436S · kind S · design
1Cited by
6References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1984 |
| Grant date | Feb 24, 1987 |
| Priority date | — |
| Expiry date | Feb 24, 2001 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.