Thermoform base with dual layers
USD585762S1 · kind S1 · design
23Cited by
73References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2007 |
| Grant date | Feb 3, 2009 |
| Priority date | — |
| Expiry date | Feb 3, 2023 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.