Connecting a flat-pack-packaged chip to a printed circuit board
USH13H · kind H · statutory invention registration
3Cited by
0References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | — |
| Grant date | Jan 7, 1986 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
A unique socket assembly is designed to interconnect a flat-pack-packaged integrated-circuit chip to a printed-circuit board in a manner that permits easy insertion and withdrawal of the packaged chip from the assembly. A base portion of the assembly includes a recess into which conductive cantilevered elements extend. When the packaged chip is positioned on these elements within the recess and a lid is placed on the base, secure but not permanent electrical contact is established between the elements and contact regions on the chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.