Method of using an improved solder to bridge a nonmetallic gap between
USH1306H · kind H · statutory invention registration
4Cited by
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24Claims
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Key dates
| Filing date | — |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
An improved solder is provided by imbedding solder with metallized fibers. he improved solder is then used to bridge a nonmetallic gap between two separated metallic surfaces by placing the improved solder on the gap and then applying heat to cause the improved solder to melt and flow and bridge the gap and connect the two separated metallic surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.