Thermal conductive material
USH1332H · kind H · statutory invention registration
6Cited by
0References
4Claims
0Family size
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Key dates
| Filing date | — |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
A three-dimensional arrangement of carbon fibers made from mesophase pitch are used to reinforce polymer resins to form a composite material. The composite material exhibits high thermal conductivity values on all axes through the composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.