Method of bonding an electrically conductive material to an electrically

USH158H · kind H · statutory invention registration

Assignee

• The United States of America as represented by the Secretary of the Army · US

Inventors

• Philip R. Frausto · Bexley, US
• Charles Wickersham · Columbus, US
• Thomas R. Tucker · Alexandria, US

Key dates

• Grant date: Nov 4, 1986

Classification

• Technology area (CPC —): General

Abstract

An improved method is disclosed of bonding an electrically conductive matal to an electrically conductive layer which is adhered to and which overlies a curved non-metallic substrate. This method comprises providing a non-metallic substrate with a curved surface. This substrate has adhered to its surface an electrically conductive layer. An electrically conductive material which is to be bonded to the electrically conductive layer is placed on the electrically conductive layer. A rigid, substantially inert and transparent to laser beam energy, cover means is placed on the electrically conductive material sufficiently to hold the electrically conductive material against the electrically conductive layer. A high energy density pulsed laser beam is directed on the materials at a sufficiently high energy density thereby welding the materials together.