Non-metallic chassis structure with electromagnetic field attenuating
USH526H · kind H · statutory invention registration
24Cited by
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19Claims
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Inventor
Key dates
| Filing date | — |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
An electronic equipment chassis structure using non-metallic plastic material such as epoxy-impregnated fiberglass together with layers of shielding metal film, preferably of copper overlaid by nickel. Desirable radio frequency shielding is achieved in comparison with the metal chassis structures and in the presence of decreased chassis mass, lower fabrication cost and chassis change enabling flexibility. Examples of material characteristics, representative fabrication costs, and attained radio frequency attenuation properties are included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.