Method and device for inspecting circumferentially conducting materials
USH879H · kind H · statutory invention registration
2Cited by
0References
10Claims
0Family size
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Key dates
| Filing date | — |
| Grant date | Jan 1, 1991 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
A device for inspection by eddy current methods of materials exhibiting cumferential conductivity. This device finds application for the inspection of filament-wound carbon fiber reinforced composites which do not usually have sufficient conductivity in the axial direction to allow inspection by conventional surface probes while still providing the desired resolution. This device is also useful in inspecting thick-walled circumferentially conductive materials, including metal, where their thickness would require a surface probe of such diameter as to be impractical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.