Thermoplastic resin composition
USH916H · kind H · statutory invention registration
Assignee
Inventor
Key dates
| Filing date | — |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | — |
Classification
- Technology area (CPC —)General
Abstract
A thermoplastic resin composition, comprising:PA0 (A) 20-95% by weight of a methacrylimide group-containing resin polymer containing at least 5% by weight of an imide ring structural unit expressed by the structural formula (I) ##STR1## (wherein R.sub.1 is a hydrogen atom or a substituted or non-substituted alkyl group having 1-20 carbon atoms, cycloalkyl group, aryl group, alkaryl group or an aralkyl group or allyl group);PA0 (B) 2.5-30% by weight of at least one thermoplastic elastomer selected from the group consisting of polyether esters, polyether ester amides and polyether amides; andPA0 (C) 2.5-50% by weight of a graft-copolymer obtained by graft-polymerizing at least one monomer selected from the group consisting of vinyl cyanate monomer, aromatic vinyl monomer and acrylic vinyl monomer to a butadiene rubber, is disclosed. This composition has balanced properties in heat resistance, impact strength and moldability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.