Electronic package and accessory component assembly
USRE31929E · kind E · reissue
Assignee
Inventors
Key dates
| Filing date | May 27, 1983 |
| Grant date | Jun 25, 1985 |
| Priority date | — |
| Expiry date | May 27, 2003 |
Classification
- Technology area (CPC —)General
Abstract
Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.